Bonding machine

  • Automatic Die-bonding machine
Automatic Die-bonding machine

Automatic Die-bonding machine

  • die-bonding machine
  • cob die bonding machine
  • COB strip light making machine
  • COB strip light die-bonding machine
  • Product description: Automatic Die-bonding machine
  • INQUIRY
die bonder

Automatic Die-bonding machine

die bonding machine

LED roll Crystal fixing machine

Model

GTS80A

System

production cycle

90ms(周期取决于晶片尺寸及支架)

XY accuracy

±1mil(±0.025mm)

chip rotation

±3°

Chip XY work table

chip size

3mil*3mil-80mil*80mil(0.076mm*0.076mm-2mm*2mm)

resolution ration

0.04mil(1μm)

chip maximum angle correction

±15°

max chip ring size

6″(152mm(External Diameter)

max chip area

4.7″(119mm(Expanded)

Thimble Z height stroke

80mil2mm

Image recognize system

Gray scale

256 degrees grey

resolution ration

656*492 pixels

image recognize accuracy

±0.025mil@50mil observation range

Crystal absorbing swing arm robotic hand system

Crystal absorbing swing arm

90°rotatable solid crystal

Crystal absorbing pressure

30g-250g can be adjusted

Feeding work table

travel area

/

XY resolution ration

0.02mil(0.5μm)

Suitable bracket size

length of bracket

/

width of bracket

Max 120mm

Required facilities

Power

220V AC±5%/50HZ

Air pressure

0.5MPaMIN

Rated power

1600W

Gas consumption

40L/min

Dimension & weight

L*W*H

189*100*175cm

Weight

1300kg


Scan the qr codeClose
the qr code